SCP006 – 8.00 Hours
Currently there are no scheduled classes for this course. However, in some cases a course can be scheduled to meet your organization’s specific needs. For more information about this course or to schedule a class, please contact Business & Cyber Solutions at or bcs@teex.tamu.edu to get the latest schedule.
Course Description
The CMP seminar provides an excellent overview of the purpose of CMP, introduction to the common tools and reviews the consumables in the CMP process. Issues related to planarization or polishing of dielectric materials and conductors, post CMP clean-up and metrology are also discussed. Also, issues related to the polishing pad conditioning, techniques used to maintain uniformity, polishing depth and postpolish cleaning are discussed. Download our in-depth course description.
Prerequisites
There are no prerequisites for this course.
Attendance Requirements
To meet attendance requirements, participants must review each training module and complete all required course assignments, activities, quizzes, and/or end of course exam.
Topics
- CMP of dielectrics
- CMP of metals
- Consumables
- Equipment fundamentals
- Metrology
- Post CMP clean-up
- Process description
- Process parameters
Suggested Audience
- Experienced wafer fab equipment operators
- Equipment technicians
- Entry-level engineers
- New fab supervisors
- New fab managers
- Professional fab support personnel
Other Information
Please call customer service at 1-800-541-7149 for more information or email us at bcs@teex.tamu.edu
Contact Information
Business & Cyber Solutions
Phone: (979) 431-4837 | Toll-Free:
Email: bcs@teex.tamu.edu